U0402FC3.3C 사양 : 3.3V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards

U0402FC3.3C 유사

U0402FC05C
- 5.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
U0402FC05C
- 5.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
U0402FC12C
- 12.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
U0402FC15C
- 15.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
U0402FC24C
- 24.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
U0402FC3.3C
- 3.3V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
U0402FC36C
- 36.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
U0404FC05C
- 5.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards

U0402FC3.3C Datasheet 및 사양

포장 :

팡 : 0

온도 : 분 -55 °C | 맥스 150 °C

파일크기 : 178 KB

응용 프로그램 : 3.3V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards